PadProbeTM for CMP Process Monitoring in the Fab
To see examples of the typical experimental data correlating Pad Wear (shown as pad thickness change), Pad Condition, Wafer Removal Rate (RR), and within the wafer non-uniformity (WIWNU), as well as the dramatic savings for the semiconductor Fabs from PadProbeTM implementation, please click on the link to the Application Note below:
PadProbe™ for Monitoring and Control of Pad Surface
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