Nano-Scale Defectoscopy 


  An advanced atomic force microscope (AFM), high-resolution, wide field-of-view optical microscope (OM) and a color CCD camera integrated into the Microscopy Head of the Universal Nano+Micro Tester are shown in Figure 1.
Large sample of semiconductor wafer (from 1” to 4” in regular configuration, 6” and 8” optional), magnetic disk (including 0.8”, 1”, 1.8”, 2.5”, 3.0” and 3.5” hard disks, 3.5” and 5.25” floppy disks), optical disk (including DVD, CD and PD), optical display (including LED, LCD and plasma), etc. can be fast positioned on the instrument table with a precision chuck (either vacuum or mechanical clamp). 



Figure 1. UNMT with AFM, OM and sample on a rotary drive.

 Depending on application, the table can be chosen to have an either rotary or linear motion with sub-micron positioning resolution. Together with precision 2-directional motion of the Microscope Head, synchronized with the state of the art control hardware and software, it allows for fast and precision AFM positioning over target areas on the sample. The instrument locates the target areas on the sample surface, for example, defects, based on the coordinates easily transferred from optical or other surface pre-characterization devices.
 

Specifications:       

AFM Scanning range xy:     80x80mm
AFM Scanning range z:       6
µm
AFM resolution:                    0.5 nm
Scanning modes:                 contact and non-contact
OM field of view:                   500
µm
OM resolution:                       3
µm
Table position accuracy:      1
µm
Rotary positioning range:     360 degrees
Radial positioning range:     75 mm


Additionally, the UNMT can perform all common tribological and mechanical tests on the same samples, with easy-exchangeable Micro-Tribology Head (for micro-scratching, micro-wear, micro-adhesion, micro-friction and micro-indentation tests) and Nano-Mechanics Head (for nano-indentation tests). Multiple swaps of the Heads maintain their position over the target sample area with an accuracy of better than 10 mm, which is a fraction of both the AFM and OM fields of view and so more than sufficient for close correlation of the pre-test and post-test images with the mechanical test data.

Process artifacts of the laser textured hard magnetic disk were investigated for the process control applications. A CCD camera view shown in Figure 2 depicts laser texture bumps and process artifacts. An image of the AFM laser beam can be seen in the background.

Figure 3 shows a 70x70mm AFM contact image of the laser textured disk area, which was located using a quick find mode. Several 5-um diameter laser texture bumps and several 2-mm wide surface scratches can be seen in the image.
 

Figure 2. CCD camera image of laser texture bumps on disk surface

 


Figure 3. AFM image of laser texture bumps on disk surface